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Huang Hui
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Paper Publications
Dynamic model and machining mechanism of wire sawing.Journal of Materials Processing Technology,2022,(311):117820.
Analysis of The Removal Mechanism of Ferroalloy by Acidithiobacillus Ferrooxidans.Procedia CIRP,2022,(110):14-19.
A novel approach to obtain near damage-free surface/subsurface in machining of single crystal 4H-SiC substrate using pure metal mediated friction.Applied Surface Science,2022,588152963.
Measurement and simulation calculation of wire bow angle during the diamond wire saw process.The International Journal of Advanced Manufacturing Technology,2021,(120):7197–7204.
多线摇摆往复式线锯切割加工运动的理论及实验研究.机械工程学报,2020,(56):219-228.
Development of a brazed diamond wire for slicing single-crystal SiC ingots.2016JCR大类-工程技术3区:INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2016,189-199.
An Experimental Research on the Force and Energy During the Sapphire Sawing Using Reciprocating Electroplated Diamond Wire Saw.2016JCR大类-工程技术3区:JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME,2016,
Effect of wire vibration on the materials loss in sapphire slicing with the fixed diamond wire.2016JCR大类-工程技术3区:MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2016,
Mechanical wear of different crystallographic orientations for single abrasive diamond scratching on Ta12W.2015JCR-大类-工程技术3区:INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS,2015,260-269.
Experimental study for single diamond grit scratching on Ta12W（单颗金刚石划擦Ta12W的实验研究).EI正刊:Mocaxue Xuebao/Tribology,2014,35635-645.
Experimental investigation on the machining characteristics of single-crystal SiC sawing with the fixed diamond wire.2014JCR-大类-工程技术-三区:INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2014,81955-965.
Experimental investigation on the machining characteristics of single-crystal SiC sawing with the fixed diamond wire.2014JCR-大类-工程技术-三区:INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2014,81955-965.
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